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Diffusion Bonding Equipment - List of Manufacturers, Suppliers, Companies and Products

Diffusion Bonding Equipment Product List

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Micro-diffusion bonding device

Micro-diffusion bonding device

【Specifications】 Pressurization method: Weight method using weights and leverage Overheating dimensions: 40 diameter x 40 height Overheating method: High frequency, programmable temperature control Maximum overheating temperature: 1400℃ Vacuum level: x10-5 PA High frequency power supply: 20KW

  • Mixer/agitator
  • Granulating Equipment

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Join without melting materials! Vacuum equipment "Diffusion Bonding Device"

It is possible to join different metal materials that are difficult to weld, as well as to join complex shapes and small materials.

The "Diffusion Bonding Device" is a product that uses our unique vacuum technology to bond metal materials at the atomic level, allowing for the bonding of different materials as well. It minimizes material deformation, which is a common issue in welding, and enables multi-layer stacking, making high-precision processing and bonding of small materials possible. 【Features】 ■ Fine temperature control through programming ■ Bonding without melting the materials ■ Available for lease options *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Mixer/agitator
  • Granulating Equipment

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Vacuum diffusion bonding device

Diffusion bonding of various metals! Introducing micro-diffusion bonding devices and high-frequency heating diffusion bonding furnaces.

We would like to introduce the vacuum diffusion bonding equipment handled by Atotech. The "micro diffusion bonding device," which bonds metals at the atomic level, is designed and manufactured using our vacuum technology. It is capable of bonding the same materials as well as different materials. Additionally, the "high-frequency heating diffusion bonding furnace" can efficiently perform diffusion bonding in a short time and can be used for diffusion bonding of various metals up to φ30. 【Micro Diffusion Bonding Device Specifications】 ■ Pressurization method: Weighted method using weights and levers ■ Overheating dimensions: 40φ×40H ■ Overheating method: High frequency, programmable temperature control ■ Maximum overheating temperature: 1400℃ ■ Vacuum level: ×10-5PA ■ High-frequency power supply: 20KW *For more details, please refer to the related links or feel free to contact us.

  • Vacuum Equipment

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